China Chipmaker Hua Hong to Build $6.7bn Wafer Fab

China’s Hua Hong Semiconductor has announced plans to build a state-backed $6.7-billion chip fab, in a joint venture with a “municipal entity” from China’s Wuxi city, Yicai Global reported.

The second-largest chipmaker in China after SMIC, Hua Hong will produce 300mm (12-inch) semiconductor wafers at the factory. They are widely used to make power and memory chips.

Read the full report: Yicai Global.

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Vishakha Saxena

Vishakha Saxena is the Multimedia and Social Media Editor at Asia Financial. She has worked as a digital journalist since 2013, and is an experienced writer and multimedia producer. As a trader and investor, she is keenly interested in new economy, emerging markets and the intersections of finance and society. You can write to her at [email protected]